SEMICON Europa 2026 runs November 10 to 13 at Messe München. It’s SEMI’s flagship European show for the semiconductor and microelectronics supply chain: equipment makers, materials suppliers, fabs, chip designers, research institutes and the policymakers who fund them.
This year it shares the fairgrounds with electronica 2026, which runs on the same four days. One badge trip to Munich covers both ends of the chain, from wafer processing and packaging to the finished components and modules.
The theme is “Europe’s Next Era: Navigating the Perfect Storm.” It’s a nod to the mix of technology and geopolitics now driving the industry. Europe has more than €43 billion mobilized through the European Chips Act, a Chips Act 2.0 taking shape, and a supply chain it wants to make harder to break. The program asks how Europe builds a competitive chip ecosystem when the global one keeps splitting apart.
The conference program
The CxO Summit opens the agenda. Senior executives from CEA-Leti, Ericsson, imec, SCREEN, Schneider Electric and TRUMPF are on the list, talking strategy and partnerships.
imec runs ITF Chip into the Future, themed “Building the Silicon Backbone of Europe’s AI Leadership.” Expect chiplet design, sustainable fab processes, the EU Chip Design Platform (EuroCDP) and the NanoIC pilot line, plus where Europe can actually lead. Robotics, telecom and next-generation compute are the sectors named.
Around those two sit a long run of Executive Forum tracks. Smart mobility. Power semiconductors and electrification. Advanced packaging, with Porsche Consulting and Entegris on scaling it up in Europe. Materials, future computing, smart manufacturing, sustainability and EHS, skills and talent. There’s a III-V Summit covering compound semiconductors for AI and data centers, a MEMS and Imaging Sensors Summit, and CHERITech’26 on hardware-level security, which matters more now that cybersecurity is turning into a chip problem.
Regional sessions are worth a look too. The Arizona Commerce Authority is pitching transatlantic partnerships, and Invest in Pomerania with the Nordic Chip Collaboration will make the case for a Baltic Sea semiconductor corridor. A Chips Act 2.0 session covers alliances with the US, Japan, Taiwan and South Korea.
Packaging, fabs and startups
Two long-running conferences anchor the technical side. The Advanced Packaging Conference covers 2.5D and 3D integration, chiplets and new interconnects for AI, HPC, automotive and edge chips. The Fab Management Forum is about the road to fully autonomous fabs, with AI-driven manufacturing at the center.
Startups get three days of pitches in front of investors and technology scouts. New this year is a hackathon with TUM Venture Labs, where teams form on the show floor and test semiconductor product ideas that could attract funding. The Innovation Showcase closes the exhibition with product announcements on the final day. SEMI also hands out its 20 Under 30 Award and hosts a Networking Night.
Who’s exhibiting and who should go
SCREEN is the top sponsor. Edwards, KLA, Schneider Electric, TEL and TRUMPF sit in the next tier, with Lam Research, ASM, Advantest, EV Group, Entegris, INFICON, Merck, Siemens and VAT among the other names on the sponsor list. That’s a fair cross-section of the equipment and materials companies that make chips possible.
Go if you buy or sell fab equipment, work in packaging or materials, run operations at a fab, or track European chip policy and investment. Investors following the semiconductor equipment cycle will find most of the relevant management teams in one hall.
Plan meetings early. With electronica running at the same time, Munich hotels fill fast. Registration is open on the official SEMICON Europa website.